Terminals - Spade Connectors

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling. For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com. 3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

- As a leading global supplier of electronic interconnects, Molex is focused on designing and developing innovative solutions critical to products that touch virtually every walk of life. Our portfolio is among the world’s largest with over 100,000 products, including everything from electrical and fiber optic interconnect solutions to switches and application tooling. Molex serves customers in a variety of industries, including the telecom, datacom, computer / peripheral, automotive, premise wiring, industrial, consumer, medical and military markets. And because we have the highest levels of R&D investment in our industry, Molex is known for providing a continuous flow of innovation in areas such as high-speed signal integrity, miniaturization, higher power delivery, optical signal transmission and sealed harsh-environment connectivity. For over 70 years, our focus has been on providing advanced products that meet tomorrow’s needs, today.

- TE Connectivity Ltd. (NYSE: TEL), formally Tyco Electronics, is a $12 billion global technology leader. Our connectivity and sensor solutions are essential in today's increasingly connected world. We collaborate with engineers to transform their concepts into creations – redefining what's possible using intelligent, efficient and high performing TE products and solutions proven in harsh environments. Our 75,000 people, including 7,300 design engineers, partner with customers in over 150 countries across a wide range of industries. We believe EVERY CONNECTION COUNTS. TE Connectivity brand products available for immediate delivery at Infinity-Semiconductor.com include AMP, Potter & Brumfield, DEUTSCH, DEUTSCH ICT, Aerospace Defense and Marine, Raychem Cable Protection, Corcom, ALCOSWITCH, Buchanan, CGS, Elcon, Kilovac, Neohm, Products Unlimited, Schrack, OEG, Sigma, Axicom, Measurement Specialties, Agastat, and CITEC.

- Providing innovative solutions for over 55 years. Panduit was born from innovation. In 1955 we launched our first product, Panduct Wiring Duct, a new invention that uniquely organized control panel wiring and allowed new wires to be added quickly and neatly. Since that time Panduit has introduced thousands of problem solving new products and remained committed to providing innovative electrical and network infrastructure solutions. Today, customers look to Panduit as a trusted advisor who works with them to address their most critical business challenges within their Data Center, Enterprise, and Industrial environments. Our proven reputation for quality and technology leadership coupled with a robust ecosystem of partners across the world enables Panduit to deliver comprehensive solutions that unify the physical infrastructure to help our customers achieve operational and financial goals.