RFI and EMI - Shielding and Absorbing Materials

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling. For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com. 3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications. The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, mechanical actuation systems, signal integrity components, and wireless antennae solutions, as well as radio frequency (RF) modules and systems. Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.

- API Delevan designs, manufactures, and markets an extensive line of quality inductors, chokes, and coils to satisfy various electrical filtering requirements. The Group concentrates on producing high performance inductive devices to meet stringent government and customer specifications relating to high product quality and reliability.

TDK Corporation (Tokyo Denkikagaku Kogyo) was established in December 1935 with the aim of becoming the world's first commercial manufacturer of the magnetic material ferrite. TDK, since then, has continued ceaselessly to turn out a variety of products and services making use of its materials technology, centering on ferrite and ceramics, and processing technology, which draws out the properties of materials to the maximum degree. The founding spirit of TDK, "contribute to culture and industry through creativity," continues to this day to pulsate throughout the company.