Memory Connectors - PC Card Sockets

- Amphenol ICC, a division of Amphenol, was established through the alignment of Amphenol FCI (AFCI) and Amphenol IT Communications Products (AITC) from January 2017. The new Amphenol ICC division is made up of the following Amphenol groups: Amphenol FCI, Amphenol Commercial Products, Amphenol High Speed Interconnects, Amphenol InterCon Systems, Cables on Demand, and Amphenol TCS. The new division further strengthens the design and manufacturing footprint while deepening relationships with Amphenol customers. Amphenol ICC is a world leader providing interconnect solutions for the information, communications, and commercial electronics markets. Amphenol ICC designs and manufactures a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, networking, industrial, business equipment, and automotive. With their global presence in R&D, manufacturing, and sales, theyare well positioned to support customers wherever they operate. Related product brands include: Amphenol, Amphenol Advanced Sensors (formerly GE Sensing), Amphenol Aerospace Operations, Amphenol Anytek, Amphenol Industrial, Amphenol LTW, Amphenol Pcd, Amphenol RF, Amphenol Sine Systems, Amphenol Spectra-Strip, Amphenol SV Microwave.

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling. For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com. 3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.

- Hirose Electric is a top-tier global connector manufacturer offering a broad range of interconnect devices including RF, coaxial, board-to-board, wire-to-board, circular, micro USB, FPC/FFC, and industrial power connectors. Our card connector series includes solutions for microSD™, SD, and Compact PCI. Hirose Electric supports advanced technologies in the consumer electronics, medical, industrial and automotive markets. Our global manufacturing operations provide optimal supply chain services. Hirose products are well-known for their exceptional quality and reliability.

- JAE Electronics is a top 10 global interconnect supplier and a recognized technology leader in fine pitch board to board, board to cable (including LVDS products), FPC (board-to-flex), memory card, input/output, circular, automotive/transportation and waterproof rated connectors. View the Product Selection Guide for more information regarding these focused product areas.

- As a leading global supplier of electronic interconnects, Molex is focused on designing and developing innovative solutions critical to products that touch virtually every walk of life. Our portfolio is among the world’s largest with over 100,000 products, including everything from electrical and fiber optic interconnect solutions to switches and application tooling. Molex serves customers in a variety of industries, including the telecom, datacom, computer / peripheral, automotive, premise wiring, industrial, consumer, medical and military markets. And because we have the highest levels of R&D investment in our industry, Molex is known for providing a continuous flow of innovation in areas such as high-speed signal integrity, miniaturization, higher power delivery, optical signal transmission and sealed harsh-environment connectivity. For over 70 years, our focus has been on providing advanced products that meet tomorrow’s needs, today.