D-Sub Connectors

- Amphenol ICC, a division of Amphenol, was established through the alignment of Amphenol FCI (AFCI) and Amphenol IT Communications Products (AITC) from January 2017. The new Amphenol ICC division is made up of the following Amphenol groups: Amphenol FCI, Amphenol Commercial Products, Amphenol High Speed Interconnects, Amphenol InterCon Systems, Cables on Demand, and Amphenol TCS. The new division further strengthens the design and manufacturing footprint while deepening relationships with Amphenol customers. Amphenol ICC is a world leader providing interconnect solutions for the information, communications, and commercial electronics markets. Amphenol ICC designs and manufactures a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, networking, industrial, business equipment, and automotive. With their global presence in R&D, manufacturing, and sales, theyare well positioned to support customers wherever they operate. Related product brands include: Amphenol, Amphenol Advanced Sensors (formerly GE Sensing), Amphenol Aerospace Operations, Amphenol Anytek, Amphenol Industrial, Amphenol LTW, Amphenol Pcd, Amphenol RF, Amphenol Sine Systems, Amphenol Spectra-Strip, Amphenol SV Microwave.

- NorComp, located in Charlotte North Carolina, is a leader in the design, worldwide manufacture, and marketing of I/O interconnect products, such as Circular Connectors, D-Subminiature, d-sub connectors, d-sub backshells & hoods, USB 2.0 / 3.0 connectors, POWER-D / Combo-D Mixed connectors, d-sub hardware & accessories, 2 MM headers, sockets, receptacles, plugs, adapters, gender changers, & more. NorComp offers a wide range of premium machined, rugged, high reliability connectors for military, industrial, medical and computer markets. With key brands such as SEAL-D (IP67 Waterproof, IP66 water resistant d-sub, POWER-D mixed connectors), M-SERIES (high reliable robust machined connectors), MICRO-D (micro miniature d sub connectors), and ARMOR (Ruggedized die cast metal backshell systems), NorComp has what you need for the most challenging design applications.

- ITT Interconnect Solutions, a division of ITT Corporation, is a world leader in the design and manufacture of highly engineered connector solutions. They operate on a global basis serving customers in the aerospace and defense, medical, oil & gas, transportation and industrial end markets. From the invention of rack-and-panel and D-subminiature to the latest fiber-optic, composite and miniaturized connectors, ITT Interconnect Solutions has been synonymous with innovation, reliability and quality for over 100 years. Today their powerful brands, Cannon, VEAM and BIW Connector Systems deliver solutions that enable the transfer of data, signal, and power in an increasingly connected world.

- TE Connectivity Ltd. (NYSE: TEL), formally Tyco Electronics, is a $12 billion global technology leader. Our connectivity and sensor solutions are essential in today's increasingly connected world. We collaborate with engineers to transform their concepts into creations – redefining what's possible using intelligent, efficient and high performing TE products and solutions proven in harsh environments. Our 75,000 people, including 7,300 design engineers, partner with customers in over 150 countries across a wide range of industries. We believe EVERY CONNECTION COUNTS. TE Connectivity brand products available for immediate delivery at Infinity-Semiconductor.com include AMP, Potter & Brumfield, DEUTSCH, DEUTSCH ICT, Aerospace Defense and Marine, Raychem Cable Protection, Corcom, ALCOSWITCH, Buchanan, CGS, Elcon, Kilovac, Neohm, Products Unlimited, Schrack, OEG, Sigma, Axicom, Measurement Specialties, Agastat, and CITEC.

- 3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling. For more information on 3M's involvement with the electronics industry, visit www.3M.com/electronics. For interconnect solutions, visit www.3Mconnector.com. 3M, MetPak and Textool are trademarks of 3M Company. Other trademarks are the property of their respective owners.